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Resume of SRD, Ph.D., P.E.
Consultant

EXPERTISE AND SERVICES

Electronics Packaging, Nanoelectronics Expert Consultant
Expertise in electronics packaging, electrically conductive adhesives, and nanoelectronics.

Has conducted numerous studies in areas including the study of structure, growth and electrical properties of discontinuous metal thin films and cermets, AFM fabrication of single-electron transistors, and metal / polymer interface. Extensive background in areas including imprint PWB technology, Cu-CVD interconnect, automotive engine control sensors, and switched-mode power supplies. Additional areas of expertise include device modeling, tunnel diodes, resonant tunnel diodes, electrical modeling in electronics packaging, packaging education, and more

PRINCIPAL INDUSTRIES SERVED
Computer, Electronics, Automotive, Communications, Manufacturing

EDUCATION
Ph.D., Electrical Engineering, University of Saskatchewan, Saskatoon, Canada
M.S., Radiophysics, University of Auckland, New Zealand
B.S., Physics, University of Auckland, New Zealand

PROFESSIONAL EXPERIENCE
Consultant, Kevin Kennedy & Associates, Inc.

Providing expertise in physics, electrical engineering, computer engineering, electronics packaging, electrically conductive adhesives, research science, inventing, and related expertise to a wide variety of clients.

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Case Studies

Professor, Department of Electrical and Computer Engineering, major university

Visiting Professor, University of Greenwich, London, Chalmers University, Gothenburg, Dresden U. of Technology, University of Canterbury, Christchurch, NZ, Helsinki U. of Technology (Nokia-Fulbright Fellow)

Adjunct Professor, Shanghai University

Guest Professor, Shanghai Jiao Tong University

Professor, Department of Electrical Engineering, State University of New York at Binghamton, NY

Visiting Professor, IXL, University of Bordeaux, France

Visiting Professor, University of Maryland, (CALCE Electronic Packaging Research Center)

Guest Professor, Chemnitz University of Technology, Germany (Microtechnology Center)

Chair, Department of Electrical Engineering, State University of New York at Binghamton, NY

ADDITIONAL EXPERIENCE

Associate Professor, Department of Electrical Engineering, State University of New York at Binghamton, NY

Director, Institute for Research in Electronics Packaging, State University of New York at Binghamton, NY

Engineer, IBM, Endicott, NY

Engineer, Delphi Engineering, Auckland, NZ

Associate Professor, Department of Electrical Engineering, South Dakota School of Mines and Technology, Rapid City, SD

Senior Lecturer, Department of Physics, Victoria University of Wellington, New Zealand

Sabbatical, Physics Dept, Loughborough University of Technology, U.K.

Lecturer, Department of Physics, Victoria University of Wellington, New Zealand

Lecturer, Department of Electrical Engineering, University of Saskatchewan, Saskatoon, Canada

Senior Technician (digital systems), Department of Electrical Engineering, University of Saskatchewan, Saskatoon, Canada

Laboratory demonstrator, Department of Physics, University of Auckland, Auckland, New Zealand

Consulting work for:
Sun Microsystems, Electronics packaging
Skyworks, Electronics packaging
Levene, Gouldin & Thompson, Industrial accident
IBM, Thin films, ion-beam etching, plasma process modeling
Universal Instruments, Electrostatic discharge (ESD) control
Control Data Corp, Low temperature CMOS
Olson Engineering, Engine control
Rapid City Computer Mapping Project, Computer graphics
Honeywell SSED, Thin films
Delphi Industries N.Z., Microprocessor applications

PROFESSIONAL REGISTRATION
Registered Professional Engineer, NY

HONORS AND AWARDS
BP Energy Award Special Commendation for VUW car project
ASEE Centennial Certificate for Service to St. Lawrence Section
IEEE CPMT Society Board of Governors Awards for Service as Treasurer
IEEE Millennium Medal
IEEE Region I Award for commitment to, dedication to, and mentorship of Electrical Engineering students
IEEE CPMT David Feldman Outstanding Contributions Award for his exceptional service to the IEEE and CPMT Society in various leadership roles, and for his pioneering work in electrically conductive adhesives

PROFESSIONAL AFFILIATIONS
IEEE Fellow, for Leadership in the Development of Electronics Packaging
Components, Packaging & Manufacturing Technology (CPMT) Society
IEEE-USA Research & Development Policy Committee
Components, Packaging & Manufacturing Technology (CPMT) Society
IEEE Nanotechnology Council representative
Associate-Editor (Adhesives), IEEE Trans. on Component & Packaging Technologies
ECTC Emerging Technologies Program Committee
Member (AVS) American Vacuum Society
Member (SAE) [Inactive] Society of Automotive Engineers (SUNY club founder)
Member (ASEE) American Society for Engineering Education
Member Sigma Xi
Member (IEPS) International Electronic Packaging Society
Member (IMAPS) International Microelectronics and Packaging Society [formed from IEPS & ISHM]
Member Tau Beta Pi & Tau Beta Pi Alumni
Member Eta Kappa Nu
National Electrical Engineering Department Heads Association (NEEDHA)
N.Z. National Electronics Development Association, Executive Committee
United University Professions: Binghamton Executive
Calling of the Engineer (Canada); Order of the Engineer (Watson School coordinator)
Editorial Boards: Recent Patents on Electrical Engineering, International Review of Electrical Engineering
Editorial Advisory Boards: Journal of Microelectronic Systems Integration, International Journal of Microelectronics Packaging

PUBLICATIONS
Author or co-author of numerous book chapters on topics related to nanotechnologies and electronics packaging.

Over one hundred publications on topics related to electronics packaging, microelectronics and photonics, nanopackaging, electrically conductive adhesives, electronic components and technology, and more.

Co-holder of one U.S. patent related to semiconductor devices.

Please note that this is an abbreviated CV. A fully detailed unabridged CV is available under special circumstances.

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Kevin Kennedy & Associates, Inc.
Rapid Response Engineering® Solutions
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Indianapolis, Indiana 46268
(317) 536-7000 voice
(317) 536-7220 fax

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