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Resume of ONK
Consultant
EXPERTISE AND SERVICES
Materials Characterization Expert ConsultantExpertise in successful development of patented state of the art ceramic, composite, metal, powder, and electronic module products and processes.
This associate has supervised major advanced materials and product development groups and has led materials research, development, and characterization projects teamed with universities and component, instrument, and material manufacturers. Additional experience in business development includes the design and implementation of a microcircuit prototype laboratory to serve electronic equipment design groups.
This KKAI consultant's unique expertise extends from processing and characterization of raw materials through the test and assurance required by components users.
Highly knowledgeable in areas related to thick film, microcircuits, multichip modules, hybrid, die bond, ceramic firing, electronic ceramic, capacitor, interconnect, printed wiring flex circuits. More areas of noteworthy expertise include component materials, wirebond, hermetic seal, adhesives, electrical properties, mechanical properties, thermal properties, high frequency materials properties, metallurgy, composite materials, coating, corrosion, nondestructive testing, materials characterization, thermal management IC packages, fine spherical powder materials, hollow microspheres, laser diffraction, PSD measurement, particle size distribution measurement, soldering, brazing, semiconductor, and aqueous clean
PRINCIPAL INDUSTRIES SERVED
Aerospace, Manufacturing, Electronics, Military
EDUCATION
MS, Materials Engineering, Worcester Polytechnic Institute (WPI), Worcester MA
BS, Liberal Arts Physics, Clarkson University, Potsdam, NY
PROFESSIONAL EXPERIENCE
Consultant, Kevin Kennedy & Associates, Inc.
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Providing expertise in materials and process engineering, product development, advanced materials, materials research, development, and characterization, ceramic, composite, metal, powder, and electronic module products and processes, patent infringement expert testimony, and related expertise to a wide variety of clients.
Speak to this experienced, world-class expert now.
- Call (317) 735-4752
- E-mail onk@rapid-response-consulting.com
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Consultant, materials and process development firm
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Founded firm to provide materials and process development, analysis, technology support, and training in electronic and structural components technology. Developed Metallurgy for Power Package for SiC Semiconductor Package for USN SBIR. Determined Microwave Package reliability through test of Al/SiC MMC with UCLA for Lockheed-Martin. Evaluated Electronic Package Metallurgical Microjoining processes for Lockheed-Martin. Designed and developed Sensor Electronic Packages for Engelhard. Performed Feasibility Study for Ceramic Factory for Samsung. Developed Ceramic Powder Processes for Corning Glass. Calibrated Powder Size Distribution Measurement for Laser Diffraction: Horiba. Developed Powder Classification Processes for Emerson and Cuming Composites.
Consultant, Digital Equipment Corporation
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Invented, patented, licensed, commercialized a Low Dielectric Constant Thick Film Ceramic. Invented, prototyped Integral Heatsink VLSI Package. Directed two Advanced Electronic Package Development engineering groups. Directed Cornell, WPI, Alfred on various ceramic materials and process programs. Directed two Advanced Semiconductor Package Engineering Development groups.
ADDITIONAL EXPERIENCE
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Developed Metallurgy for Thin Film Resistor Attached to Heat Sink
Thin film resistors attached to heat sinks or spreaders were failing after several thermal cycles. New metallurgy was developed to minimize thermal cycle failures. Metals combinations were tested successfully.
Developed Annealing Process and Process Control Instrumentation
Laser micromachined substrates have residual stresses and excess camber and require annealing at high temperature. Developed and implemented an annealing process, and implemented process control instrumentation and data acquisition hardware and software. The company was able to ship substrates that had many holes and cut shapes that were dimensionally stable.
Developed powder process to facilitate next generation product
The powders used for a new generation catalytic converter were too large to reliably fabricate thin walled cells. Introduced many candidate processes and evaluated the results of tests on many machines. It was creatively determined that a combination of two processes would bring the powder size down to a level that the new product could be prototyped.
Assured new composite reliability for high reliability component
Mechanical strength reliability of a new composite material for microwave modules in a high stress environment required assurance. Working with UCLA, a battery of mechanical strength tests was devised and a Finite Element Model was used to determine stresses on the structural component. It was concluded that the composite material could be used, as modeled and predicted stresses were less than the material strength data.
Developed sizing process for fragile powder
Hollow glass microspheres used in a new material had a maximum diameter larger than the thickness of the insulation layer. Applied the principles of a test for small particles to a new process for size sorting. Extracted particles of 20 microns maximum from a batch of material with sizes up to 40 microns, meeting the requirement for insulator thickness.
Formulated, Invented, Tested, Patented, Licensed, Marketed new Ceramic
Ceramic materials have higher dielectric constant than can be used in high frequency semiconductor packages. Invented a material that had lower dielectric constant. The material was tested, patented and licensed a materials manufacturer.
Invented, patented, prototyped, characterized thermally efficient IC package
For reliability, the semiconductor temperature must remain low, however as its functionality increases, power and heat density increases. Invented and prototyped a package with thermally efficient ceramic molded in the shape of a heat sink, and the chip mounted directly. The invented package was thermally efficient, readily manufactured, and had fewer separate components. The approach was subsequently patented.
PROFESSIONAL AFFILIATIONS
International Microelectronics and Packaging Society (IMAPS)
American Ceramics Society (ACerS)
PUBLICATIONS
Hold patents for ceramic, composite, metal, powder, and electronic module products and processes. Author of numerous publications related to hollow and solid spheres and microspheres, substrate and package materials and strength of materials and microstructures, substrate materials and products development for high frequency applications microwave, power packaging, and more.
Please note that this is an abbreviated CV. A fully detailed unabridged CV is available under special circumstances.
Read articles by this associate:
The Evolution of a Ceramic Materials System for Chip Packaging
Electrical and Materials Characterization of Microsphere Powder
Complex Module For High Frequency Applications
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Kevin Kennedy & Associates, Inc.
Rapid Response Engineering® Solutions
3905 Vincennes Road, Suite 320
Indianapolis, Indiana 46268
(317) 536-7000 voice
(317) 536-7220 fax