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Resume of OMJ, Ph.D., P.E.
Consultant
EXPERTISE AND SERVICES
Microelectronic Fabrication Technology, Expert ConsultantExpertise in microelectronic fabrication technology, radiation effects in semiconductor materials and devices, semiconductor device physics and reliability, semiconductor materials synthesis and characterization, synthetic diamond high temperature superconductors, integrated passives, composite material coatings (e.g., cBN).
Extensive knowledge regarding metal-induced crystallization (MIC) of amorphous silicon, amorphous silicon solar cell development, nonvolatile semiconductor memory technology, synthesis, deposition and characterization of novel materials for a variety of applications, advanced electronic packaging technology including microelectromechanical systems [MEMS].
Highly regarded in areas including microelectronics reliability, photonics, microcircuit fabrication, electronics manufacturing, solar energy materials and solar cells, metallurgical coatings and thin films, materials research, dielectric materials, smart materials, ultrafine and nano particles, electronics components and technology, surface and coatings technology, renewable energy, solid state technology and devices
PRINCIPAL INDUSTRIES SERVED
Aerospace, Defense, Computer, Electronics, Government, Power, Manufacturing
EDUCATION
Ph.D., Electrical Engineering, University of New Mexico, Albuquerque, NM
M.S., Electrical Engineering, Pennsylvania State University, State College, PA
B.S., Electrical Engineering, University of Arkansas, Fayetteville, AR
Electronics Technology Degree, Cleveland Institute of Electronics, Cleveland, OH
A.A., Mathematics, Allan Hancock Junior College, Santa Maria, CA
PROFESSIONAL EXPERIENCE
Consultant, Kevin Kennedy & Associates, Inc.
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Providing expertise in electrical engineering, microelectronic fabrication technology, advanced electronic packaging, semiconductor device physics and reliability consulting, research, inventing, and related expertise to a wide variety of clients.
Speak to this experienced, world-class expert now.
- Call (317) 735-4834
- E-mail omj@rapid-response-consulting.com
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Distinguished Professor of Electrical Engineering, College of Engineering, major university
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Research efforts included metal-induced crystallization (MIC) of amorphous silicon, amorphous silicon solar cell development, nonvolatile semiconductor memory technology, synthesis, deposition and characterization of novel materials for a variety of applications, and advanced electronic packaging technology including microelectromechanical systems [MEMS].
Interim Head of the Department of Electrical Engineering, Distinguished Professor of Electrical Engineering, College of Engineering, major university
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Had administrative responsibility for the Department of Electrical Engineering. Research efforts included metal-induced crystallization (MIC) of amorphous silicon, amorphous silicon solar cell development, nonvolatile semiconductor memory technology, synthesis, deposition and characterization of novel materials for a variety of applications, and advanced electronic packaging technology including microelectromechanical systems [MEMS].
Associate Dean of Engineering for Research, Interim Head of the Department of Electrical Engineering, Distinguished Professor of Electrical Engineering, College of Engineering, major university
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Was responsible to oversee all aspects of the research program of the College of Engineering. Had administrative responsibility for the Department of Electrical Engineering. Research efforts included metal-induced crystallization (MIC) of amorphous silicon, amorphous silicon solar cell development, nonvolatile semiconductor memory technology, synthesis, deposition and characterization of novel materials for a variety of applications, and advanced electronic packaging technology including microelectromechanical systems [MEMS].
Associate Dean of Engineering for Research, Distinguished Professor of Electrical Engineering, College of Engineering, major university
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Was responsible to oversee all aspects of the research program of the College of Engineering. Research efforts included metal-induced crystallization (MIC) of amorphous silicon, amorphous silicon solar cell development, nonvolatile semiconductor memory technology, synthesis, deposition and characterization of novel materials for a variety of applications, and advanced electronic packaging technology including microelectromechanical systems [MEMS].
Associate Dean of Engineering for Research, Interim Director of the High Density Electronics Center (HiDEC), Distinguished Professor of Electrical Engineering, College of Engineering, major university
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Was responsible to oversee all aspects of the research program of the College of Engineering. Had oversight responsibility for both technical and administrative aspects of the High Density Electronics Center. Research efforts included metal-induced crystallization (MIC) of amorphous silicon, amorphous silicon solar cell development, nonvolatile semiconductor memory technology, synthesis, deposition and characterization of novel materials for a variety of applications, and advanced electronic packaging technology including microelectromechanical systems [MEMS].
Associate Dean of Engineering for Research, Acting Associate Dean for Academic Programs, Interim Director of the High Density Electronics Center (HiDEC), University Professor of Electrical Engineering, College of Engineering, major university
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Was responsible to oversee all aspects of the research program of the College of Engineering. As Acting Associate Dean for Academic Programs, had oversight responsibility for departmental assessment process (ABET) and both undergraduate and graduate academic programs. Had oversight responsibility for both technical and administrative aspects of the High Density Electronics Center. Continued research efforts in amorphous silicon solar cell development, nonvolatile semiconductor memory technology, synthesis, deposition and characterization of novel materials for a variety of applications, and advanced electronic packaging technology including microelectromechanical systems [MEMS].
Associate Dean of Engineering for Research, University Professor of Electrical Engineering, Interim Director of the High Density Electronics Center (HiDEC), College of Engineering, major university
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Was responsible to oversee all aspects of the research program of the College of Engineering. Had oversight responsibility for both technical and administrative aspects of the High Density Electronics Center. Continued research efforts in amorphous silicon solar cell development, nonvolatile semiconductor memory technology, synthesis, deposition and characterization of novel materials for a variety of applications, and conventional electronic packaging technology.
Associate Dean of Engineering for Research, University Professor of Electrical Engineering, College of Engineering, major university
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Pursued research for the College of Engineering by working with faculty members throughout the College of Engineering. Continued to teach courses in microelectronics, electronics manufacturing, electronic packaging, and solid-state physics. Continued research efforts in amorphous silicon solar cell development, novel material development for microelectronic devices, radiation effects in semiconductor materials and high temperature superconductor thin films, nonvolatile semiconductor memory technology, deposition and characterization of synthetic diamond substrates and thin films, deposition and characterization of high temperature superconductor thin films, characterization of quantum-well and modulation-doped heterostructures using photothermal deflection spectroscopy, and conventional multichip module (MCM) packaging technology.
University Professor and Head, Department of Electrical Engineering, major university
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Continued to teach courses in microelectronics, electronics manufacturing, electronic packaging, and solid-state physics. Continued research efforts in amorphous silicon solar cell development, novel material development for microelectronic devices, radiation effects in semiconductor materials and high temperature superconductor thin films, nonvolatile semiconductor memory technology, deposition and characterization of synthetic diamond substrates and thin films, deposition and characterization of high temperature superconductor thin films, characterization of quantum-well and modulation-doped heterostructures using photothermal deflection spectroscopy, and conventional multichip module (MCM) packaging technology.
ADDITIONAL EXPERIENCE
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Professor and Head, Department of Electrical Engineering, major university
Continued to teach courses in microelectronics, electronics manufacturing, and solid-state physics. Developed courses and contributed/edited textbook on advanced electronic packaging technology. Continued research efforts in amorphous silicon solar cell development, novel material development for microelectronic devices, radiation effects in semiconductor materials and high temperature superconductor thin films, nonvolatile semiconductor memory technology, deposition and characterization of synthetic diamond substrates and thin films, deposition and characterization of high temperature superconductor thin films, characterization of quantum-well and modulation-doped heterostructures using photothermal deflection spectroscopy, and conventional multichip module (MCM) packaging technology.
Professor and Head, Department of Electrical Engineering, Director: High Density Electronics Center (HiDEC), major university
Continued to teach courses in microelectronics and solid-state physics. Developed course in electronics manufacturing processes with Industrial Engineering Department. Continued research efforts in amorphous silicon solar cell development, radiation effects in semiconductor materials, nonvolatile semiconductor memory devices including ferroelectrics, and novel material development for microelectronic device applications. Established the High Density Electronics Center (HiDEC) and directed research on synthetic diamond and superconducting thin films for application in multi-chip module (MCM) packaging technology.
Professor and Head, Department of Electrical Engineering, major university
Continued to teach courses in microelectronics area. Developed graduate-level courses in semiconductor surfaces and radiation effects in semiconductor devices and circuits. Extended research to include amorphous silicon solar cell development, radiation effects in semiconductor materials, and novel material development for microelectronic device applications.
Associate Professor and Head, Department of Electrical Engineering, major university
Continued previous activities.
Summer Faculty, Sandia National Laboratories, Albuquerque, New Mexico
Characterization of Sandia's MONOS device technology for radiation hardness.
Associate Professor of Electrical Engineering, major university
Continued to teach undergraduate and graduate level courses in the microelectronics area, completed development of integrated circuit fabrication laboratory and completely restructured all microelectronics electives. Expanded research interests to include optoelectronic devices and the characterization of semiconductor materials.
Assistant Professor of Electrical Engineering, major university
Taught undergraduate courses in electronic circuits, semiconductor devices and integrated circuit processing technology. Began developing senior-level integrated circuit fabrication laboratory. Taught graduate-level courses in solid-state device physics and optoelectronics. Conducted research on MNOS devices and semi-conductor materials.
Adjunct Professor of Electrical Engineering, Department of Electrical and Computer Engineering, University of New Mexico, Albuquerque, NM
Taught graduate level courses in solid-state device physics and integrated circuit processing technology.
Member of the Technical Staff, Sandia National Laboratories, Albuquerque, NM
Designed test equipment for weapons systems. Studied EMP effects on semiconductor devices, radiation effects on semiconductors, and effects of processing on radiation sensitivity of semiconductor devices. Designed, built and equipped a 500 square foot integrated circuit fabrication facility. Developed processing technology for MNOS memory technology and radiation-hardened CMOS technology. Designed, built and equipped a 5500 square foot, class 100 clean room for integrated circuit manufacturing.
Graduate Student, Pennsylvania State University, State College, PA
Attended graduate school under Sandia Laboratories' One Year On Campus educational program.
Member of the Technical Staff, Sandia National Laboratories, Albuquerque, New Mexico
Designed the electrical power system for a large centrifuge located at the Pantex weapons testing facility.
Consulting Activities:
Air Force Weapons Laboratory, Kirkland AFB, Albuquerque, New Mexico on EMP, IEMP and SGEMP failure in semiconductors
National Security Agency on semiconductor device design and fabrication
Sandia National Laboratories, Albuquerque, New Mexico on MNOS technology
Gordos of Arkansas, Rogers, Arkansas on hybrid microcircuit fabrication
Washington County Sheriff's Office, Fayetteville, Arkansas on electronic intrusion alarms and mobile communications
Arkansas Power and Light, Little Rock, Arkansas
Texas Instruments, Inc., Sherman, Texas on electromigration and corrosion of metallization systems for integrated circuits
Keithley Instruments, Inc., Cleveland, Ohio on semiconductor materials, devices and processing
Texas Instruments, Inc., Dallas, Texas on radiation hardening of linear CMOS circuits built in SOI
The St. Paul Fire and Marine Insurance Company, Little Rock, Arkansas, on evaluation of fire damage to an electrical supply and control panel
Atmel Corporation, San Jose, California, on semiconductor fabrication technology for hot carrier injection in CMOS EPROMs
Optivision, Inc., Palo Alto, California, on synthetic diamond technology
STMicroelectronics, Dallas, Texas, on method of fabricating an MOS memory array having electrically-programmable and electrically-erasable storage devices incorporated therein
Oklahoma State University, Stillwater, Oklahoma on proper utilization of clean room space located in a research center
The government of the United Arab Emirates to perform an accreditation review of the Electrical Engineering Department of the University of Sharjah
ITT Night Vision of ITT Industries, Roanoke, Virginia, on reliability issues with wire bonding SiC ICs to 40 pin LCCs and packaging sealing for high temperature operation
PROFESSIONAL REGISTRATION
Licensed Professional Engineer, Arkansas
HONORS AND AWARDS
Certificate of Appreciation, Industrial Training Program, State of Arkansas, for Distinguished Service in Promoting Industrial Training in Arkansas
Department of Electrical Engineering Halliburton Award for Excellence in Teaching
Member of the Arkansas Academy of Electrical Engineering
Charter Member of the Society of Penn State Electrical Engineers (SPSEE)
College of Engineering Phillips Petroleum Company Outstanding Faculty Award
Thomas D. Callinan Award by the Dielectric Science and Technology Division of The Electrochemical Society
Elected Fellow of the Electrochemical Society
Electrical and Computer Engineering Department Heads Association (ECEDHA) Outstanding Leadership and Service
Elected Fellow of the Institute of Electrical and Electronics Engineers
Phi Eta Sigma
Eta Kappa Nu
Tau Beta Pi
Pi Kappa Alpha
PROFESSIONAL AFFILIATIONS
Institute of Electrical and Electronics Engineers (IEEE)
IEEE Nuclear and Plasma Sciences Society
IEEE Components, Packaging, and Manufacturing Technology Society
IEEE Electron Devices Society
IEEE Education Society
International Microelectronics and Packaging Society (IMAPS)
The Electrochemical Society (ECS)
The Materials Research Society (MRS)
The American Vacuum Society (AVS)
The American Society for Engineering Education (ASEE)
The Arkansas Academy of Science
PUBLICATIONS
Co-holder of 15 patents related to the fabrication of silicon nanowires and films, planarized polycrystalline diamonds, solar cells, and more.
Hundreds of publications on topics related to MOS Technology, amorphous silicon technology, surface and coatings technology, packaging of MEMS devices, microelectronics reliability, superconductivity, solar energy materials and solar cells, and more.
Author and coauthor of many books related to microcircuit fabrication, semiconductors, electronics manufacturing, microelectronics, solar energy, electronics packaging, and more.
Over 300 technical presentations on topics related to metallurgical coatings and thin films, advanced electronic packaging, materials research, microelectronics, photonics, dielectric materials, smart materials and MEMS, ultrafine and nano particles, electronics components and technology, renewable energy, solid state technology and devices, and more.
Please note that this is an abbreviated CV. A fully detailed unabridged CV is available under special circumstances.
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Kevin Kennedy & Associates, Inc.
Rapid Response Engineering® Solutions
3905 Vincennes Road, Suite 320
Indianapolis, Indiana 46268
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