Automotive Design Manufacturing Expert Consultant ResumeThis expert has experience in development of automotive product manufacturing strategies, optimization of manufacturing processes, and materials selection for manufacturing. Quality assurance, control, and leading program implementation for specific products and families of products are other areas of expertise this consultant has.
This associate offers automotive design manufacturing expertise with special interests in high-volume assembly, electronics, semiconductor, and consumer product manufacturing. Other areas of expertise this consultant has include hybrid, PCB (printed circuit board), and PWB (printed wiring board) packaging. Design for mechanical assembly, wave soldering and metal surface finishing, flip chip applications are further areas of knowledge this expert has.
Specialization of this consultant includes ABS applications, thermal package design, thermal buffer systems for power IC's, and high density PWB's. This expert also has knowledge in flexible robots, surface mount technology, SMT, testing, and development of patentable new manufacturing processes. Automotive electronics manufacturing, development of company trade secrets, automotive electronic assembly issues, and process of product validation are further areas of expertise this consultant has. This expert also has knowledge in mechatronics, and smart electro-mechanical systems.
This expert is also highly experienced regarding single digit ppm, paint, spray, dip, and seal options for PCBs. This expert also offers expertise in off the shelf IC's, flip chips in automotive electronics, flip chip soldering fluxes, and clean or no-clean processing. Other areas of expertise this consultant has include environmental friendly product design, IC's or substrates, power dissipation, milliwatt to kilowatt, and embedded electronics. Advanced product development viable, and the future of automotive electronics are interests of this consultant.
Consultant, Kevin Kennedy Associates Inc.
Providing project management, mechanical engineering, manufacturing engineering, electronics design and manufacturing consulting services to a wide variety of clients.
Advanced Engineering, Delco Electronics Corporation, Kokomo, IN
Managed an engineering group responsible for the development of innovative product packaging designs, the manufacturing processes necessary to implement these designs in high volume production, and develop/perform the necessary testing to prove the design capable for its application.
A major accomplishment of this group was to develop a flip chip on laminate system capable of being used in engine compartment and on-engine applications. This technology went into production on specific engine controls and ABS (antiskid braking systems) applications with significant product cost and size reductions.
Other developments include; Design For Manufacturing, improved thermal package designs, thermal buffer systems for power IC’s, high density and higher temperature PWB’s (4 mil lines and spaces), flexible robots for manufacturing, gold wire bonding to PWB’s, solder jetting, and conductive adhesive.
Technical Fellow, Delco Electronics Corporation
Automotive Design Manufacturing Engineering, Delco Electronics Corporation, Kokomo, IN
Managed an Advanced Manufacturing Engineering group charged with the global corporate implementation of surface mount technology (SMT) on Delco Electronic PWB products (radios, engine controls, heater/air controls, etc.). Coordinated international rollout of manufacturing systems at global assembly sites.
Major developments include three generations of high volume component placement equipment, component tape and reel packaging specifications (chips and IC’s), product design specifications for efficient manufacturing, improved component designs and tolerances for improved placement, solder and glue development, solder and glue printing, glue cure, solder reflow, (3 generations), flux cleaning, X-ray placement inspection, electrical test, in-line processing with error-proof techniques, and multi-product SMT (surface mount transistor) assembly lines.
Automotive Design Manufacturing Engineering, Delco Electronic Corporation, Kokomo, IN
Provided project coordination for manufacturing strategy, high volume hybrid SMT assembly, leak proof sensor cell assembly, leak proof plastic housing assembly, and product flow through trimming, test, and final packaging for the first generation pressure sensor, and managed startup of the facility.
Automotive Design Manufacturing Engineering, Delco Electronics Corporation, Kokomo, IN
Coordinated assembly strategy, internal development of special equipment for assembly and test for bridge audio IC, and coordinated the start-up of facility.
Automotive Design Manufacturing Engineering, Delco Electronics Corporation, Kokomo, IN
Served as a part of a team, which developed the Diode Trio and Button Diode rectifiers for automotive charging systems. Coordinated equipment with vendors, worked “Design For
Manufacturing” issues between equipment and product designs, started up facility and supported initial production.
Manufacturing Engineering, Delco Electronics Corporation, Kokomo, IN
Floor support Engineer for battery charging diode and electromotive power diode wafer processing and test.