Experts
EXPERTLY ORCHESTRATED GENIUS
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Resume of BLI
Consultant
PRINCIPAL INDUSTRIES SERVED
- High-Tech
- Microelectronics
- Semiconductor
- Medical Electronics
EDUCATIONThis expert received a Bachelor of Engineering degree, specialization in Chemical, from the McGill University in Montreal, Quebec.
This expert received a Bachelor of Science degree in Biochemistry from the Université Laval in Quebec.
This expert has a Teaching Certificate in Sciences, received from the Université du Quebec in Montreal, Quebec. EXPERTISE AND SERVICESProduct Marketing, Manufacturing Automation, Process Engineering Expert Consultant ResumeThis expert has keen knowledge in microelectronics manufacturing, automation, process engineering, and root-cause analysis. Other areas of this consultant’s expertise include strategic planning, market research, technology road mapping, and business development. Furthermore, this expert has experience in sales analysis and forecasting.
Areas of this expert's specialization include:
- Packaging Engineering
- Wafer Bumping
- Electronics Assembly
- Strategic Research
- Competitive Analysis
- Sales
- Relationship Management
- Negotiation
- Facilitating New Ideas
- Complex Project Implementation
- Creating Strategic Vision w Staff Development
- Cross Functional Coordination & Leadership
- Electrochemistry
Additional experience and specialization of this expert includes new products and new process introduction, automation analysis, training curricula, and process and quality control. This expert also has experience in Project ROI analysis, defining feasibility studies, and developing statements of work (requirements definition). Equipment vendor selection, vendor quote analysis, vendor site evaluation, and post installation buy-off are other areas of expertise this consultant has. This expert also has knowledge in market overviews, customer applications analysis, market positioning, and defining marketing/sales organization. Other areas in which this consultant specializes in include business development and accounts development, partnering identification, acquisition assessment, and product strategies. Business process analysis, advertising and promotion, trade shows, technical writing and literature generation are included in this consultant's areas of expertise.
This consultant offers additional specialization and expertise in packaging engineering, international marketing services, and semiconductor capital equipment. 3-D packaging, high-tech strategy, and medical electronics are other areas of expertise this consultant encompasses.
This consultant is an experienced and results-driven technical manager with proven leadership in global product marketing and business development. Capabilities of this expert include technical expertise in microelectronics manufacturing and assembly, and recognized project management skills
PROFESSIONAL EXPERIENCEConsultant, Kevin Kennedy Associates Inc. Providing expertise in product marketing, manufacturing automation, process engineering, microelectronics manufacturing, root-cause analysis, strategic planning, market research, technology road mapping, business development, and related expertise to a wide variety of clients. Global Marketing Director, solutions provider for semiconductor assembly, automotive and medical electronics Custom applications are focused on the automation of medical embedded devices, sensors and wearable medical monitoring devices. Customers include large OEMs, IDMs and Tier 1 assemblers. This consultant joined the group as marketing director with the goal of growing the business and providing branding concept. Also managed the applications engineering team. Global marketing and product management responsibilities for products and services included development and implementation of worldwide automation solutions, sales and marketing strategies, technical roadmaps and business plans for the novel business concept; Asian, European and North American business development and technical support to sales. Additional responsibilities included development of new automation solutions for solar panel assembly, embedded components and medical sensor assembly. Was responsible for management of applications and manufacturing teams from different founding divisions. Developed new corporate identity. Product Manager, Universal Instruments Corp, Binghamton, NY The firm delivers automation solutions to the electronics industry. Customers included Manufacturing Service Providers (Foxconn, Flextronics, Jabil, Solectron, Celestica) and large OEMs (Sony, Motorola, Ericsson). A division was established to focus on emerging markets in semiconductor assembly. This consultant joined the team as product manager with the goal of growing the business which, until then, had been generating revenues of less than 10M, from a limited US-based customer set. Responsibilities included: global business development; sales prospecting and customer presentations worldwide; development and implementation of worldwide automation solutions, sales and marketing strategies, technical roadmaps and business plans for the emerging advanced semiconductor assembly market (flip chip, photonics, Image sensors, RFID, LEDs); Asian, European and North American business development. Other contributions included setup of Asian sales agents; development and rollout of flip chip and optoelectronics automation solutions; project direction of cross-company RFID effort; WW Application Engineering and Product Marketing management; Software Engineering management. Development of new software functions. Startup of Bangalore India effort. Joint projects with Universal research lab such as RFID die attachment. Other responsibilities included technology seminars, exhibits, Private shows, technology workshops, sales - negotiations and closings, technology watch and competitive analysis, and more. Manufacturing Engineering Management, IBM Canada LTD, Bromont, Quebec Specialized in semiconductor packaging, wafer bumping and multi-chip module substrate manufacturing, providing back-end operations for semiconductor packaging, receiving IC devices from the East Fishkill (NY) and the Burlington (VT) wafer fab centers. This consultant served as a process engineer, specializing in electrochemical processes. Positions held over a 17-year career included: Process/Equipment Manufacturing Engineer, Manufacturing Operations Manager, Failure Analysis Manager, Development/ New Products Engineering Manager. Responsibilities included: Business development, Sales and Marketing of Semiconductor Packaging Services, Account Management, Technical Marketing - technical papers, conferences, technical committees, trade associations; Manufacturing and Engineering Management: Chip Carrier Manufacturing (Photolithography), Wafer Bumping, Chip Burn-in, Electroless Plating; SQA and Lab Management - High End Failure and Construction Analysis, developed relationships with Canadian universities and IBM research facilities. Implemented SQA and Six-Sigma program. ADDITIONAL EXPERIENCEDemonstrated ability to close and manage deals all through the sales cycle. Recognized ability to develop/lead profitable and effective organizations. Unique ability to develop new markets, manage large and complex engineering projects, as well as to analyze and resolve highly complex technical/logistical problems. Adept at developing and managing international cross-functional teams and implementing new business processes. Extensive international experience with strong Asian network. Can legally work in the United States and Canada.
Managed the 2007 launch of a new 30M business unit, including the development and execution of the branding strategy, the positioning strategy and the marketing communications strategy. The firm is now recognized worldwide as a knowledge-based solutions provider.
Developed new markets, and delivered turnkey automation solutions, for System In Package, solar panel assembly, embedded components and medical sensor assembly. Integrated and managed new Applications Engineering team.
Developed new semiconductor capital equipment market at Universal. Increased revenue from 5M to 15M USD. New revenue in Medical Electronics, Automotive Sensors, Photonics, SiP and RFID applications. Completely new Asian market of more than 10M. More than 30 new accounts.
Re-engineered the new business group after Y2001 downsizing. Included application engineers, software engineers and business developers in one team. Started up Software Engineering team in Bangalore, India and recruited and trained China personnel.
Developed new sales channel in China, Taiwan, Philippines and Korea. Setup contract with local sales agent. Recruited personnel.
Initiated novel technical marketing programs. Numerous technical marketing publications in trade journals, conferences, international technology road shows and workshops. First Universal Webinar in 2000.
Managed 2003 SARS company crisis action plan. Stationed in Hong Kong at the time with family.
Established and purchased an Advanced Process Lab for a new technology center in Suzhou, China. Met Cost and Schedules.
Managed development and volume ramp-up of complex photolithography and electrochemical processes (C4NP Bumping, Gold bumping, electroless gold, chip burn-in) while managing IBM development engineering team. Recognized industry-wide as an expert in the field of electroless plating and advanced packaging. Responsibilities included Manufacturing and Engineering as part of phase-in. Met all cost targets and schedules.
Managed IBM’s Supplier Quality Assurance Program as well as metrology, analytical & failure analysis Labs.
Taught Chemistry and Physics as a first job. Developed curricula and setup a lab for a private high school institution.
Other areas of expertise include:
- Marketing
- Establishing product strategies and roadmap
- Product Positioning
- Competitive Analysis
- Technical Marketing: preparing technical papers and presentations
- Building in-house management training classes
- Detailed Market analysis
- Business Development plans
- Concepts, Cost Of Ownership analysis
- Development of Statement of Work, Procurement Specification
- Vendor Comparison
- Manufacturing Engineering
- Yield Management
- Root Cause Problem Solving
- Failure Analysis
- Design Of Experiments
- Statistical Analysis
- Large Scale Project Management
- New Product Introduction
- Scale-up
- Management
- Developing matrix structures
- Organizational reviews
- Personnel and Career roadmaps
- Packaging for Electronics / Semiconductor Assembly
- Equipment selection
- Flip Chip Assembly
- Manufacturing Optimization
- Problem solving - yields and reliability
- Materials Selection for new processes and new products
- Electroless Plating
- Electroless Nickel
- Immersion Gold
- Electroless Gold
PUBLICATIONSThis expert is the author of numerous publications in technical journals. Case Studies
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