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Printed Wiring Boards (PWBs) Failure Analysis

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XVH is a Aerospace Engineer, Mechanical Reliability Engineer, Engineering Failure Analysis, Military and Defense Engineering Consultant, System Safety Consultant with world-class expertise in reliability modeling and prediction, reliability issues, military standards, system safety hazard analysis, solder joint thermal fatigue analysis, steinberg model, scanning electron microscope (SEM), weibayes analysis, and stress strength interference.

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Recently, some of the Printed Wiring Boards (PWBs) were returned from the field with cracked capacitors on them. Failure Review Board was convened to determine the root cause of the anomaly and to provide corrective action for mitigation. Typically, the crack on capacitor occurs either due to mechanical stress or thermal stress. These cracks have certain signatures that distinguish them from the mechanical and thermal induced-stress failures. The cracked capacitors were removed from the PWBs and potted for cross sectioning. The cross sections of the capacitors were examined under the Scan Electronic Microscope (SEM) to determine the type of cracks. The SEM confirmed that the internal cracks on the capacitors were mechanical in nature. The origin of the mechanically induced cracks was later traced to the flexing of the PWB during operation. During the course of investigation, it was discovered that the wrong size of shim was being used between the chassis and the PWB, causing PWB to flex. This resulted in the mechanical induce stress on the PWB. The fault was mitigated with the use of correct size of shim and implementation of various recommendations presented by the FRB in the assembly process.

Read other articles by this KKAI Associate:

Spacecraft Transmitter Anomaly

Structural Failure of Titanium Shaft

Aerospace Engineer, Mechanical Reliability Engineer, Engineering Failure Analysis, Military and Defense Engineering Consultant, System Safety Consultant, reliability modeling and prediction, reliability issues, military standards, system safety hazard analysis, solder joint thermal fatigue analysis, steinberg model, scanning electron microscope (SEM), weibayes analysis, and stress strength interference.
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Rapid Response Engineering® Solutions
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