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Electrical and Materials Characterization of Microsphere Powder
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ONK is a Materials and Process Engineer, Product Development Specialist, Advanced Materials Consultant with world-class expertise in successful development of patented state of the art ceramic, composite, metal, powder, and electronic module products and processes.
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Electrical and Materials Characterization of Microsphere Powder to be a constituent in a Thick Film Composite
This case study focuses on one specific development, part of an all ceramic materials system fulfilling electrical, physical, mechanical, and thermal requirements of a complex module for high frequency applications.
Due to high capacitive loads and the requirement to lower propagation delays in digital applications and to provide an impedance - controlled dielectric for microwave applications, a new dielectric was invented. The essence of the invention was to develop a composite adding hollow microspheres (constant 1.1) to thick film glass ceramic dielectric lowering its constant from 8.5 to 4.0 by adding hermetic porosity.
This case study focuses on the electrical and materials characterization of the spheres that are to be added to the conventional glass ceramic thick film dielectric. The purpose of the characterization was to better predict the net high frequency dielectric properties of the new composite, i.e., thick film dielectric plus microspheres.
The experimental Technique was to test the dry spheres as a powder using the cavity resonator technique. This involves first measuring the resonant frequency and Q of an empty cavity over a frequency range of 2-20 GHz, then measuring with the powder sample in the cavity. The resonant frequency and the Q factor are then used to characterize the relative dielectric constant and the loss factor, Tan D. Further, materials that were previously characterized were also measured in the same way to assure that the results are consistent and within experimental error. Samples from three different manufacturing lots were characterized.
Read other articles by this KKAI Associate:
The Evolution of a Ceramic Materials System for Chip Packaging
Complex Module For High Frequency Applications
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