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The Evolution of a Ceramic Materials System for Chip Packaging

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ONK is a Materials and Process Engineer, Product Development Specialist, Advanced Materials Consultant with world-class expertise in successful development of patented state of the art ceramic, composite, metal, powder, and electronic module products and processes.

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The requirements for multi and single chip packaging reflect the electrical system and the semiconductor being packaged. There are electrical, mechanical, and thermal requirements that must be met by the package. These include:

  1. Low dielectric constant and low electrical loss insulation materials in a multilayer substrate. This yields lower propagation delay and capacitive loading of signals. This is necessitated due to frequencies range 5-20 GHz, 50 ohm impedance control, minimized power/ground noise and signal crosstalk.
  2. High metal pattern density and stability to interface with high density semiconductor I/Os.
  3. High current carrying capability for power and ground structures
  4. Efficient thermal design for higher power dissipation.

A development effort to produce prototypes meeting the above requirements was undertaken. The design attributes of the prototype:

The following were the team members:

For low dielectric constant, the low dielectric constant thick film material developed by the consultant, DEC, and EMCA was utilized. This patented composite material had an engineered microstructure with closed cell pores of constant 1.0 represented by the following photomicrograph:

For high pattern density and stability two approaches were tested.

The first was a thick film multilayer structure fabricated by Teledyne Microcircuits, Marina Del Ray, CA. Thick film is dimensionally stable as materials are added to an already fired substrate, constraining all shrinkage to the thickness or "Z" direction, leaving a fixed XY plane for critical interconnections. Below is a photograph of the prototypes.

The prototypes incorporated low constant thick film material between signal layers, gold for low resistance and loss, and laser drilled vias.

Using the same design, prototypes were produced by CPT incorporating LTCC power and ground structure on alumina. Low constant thick film dielectrics were applied to that structure between signal layers. Follows is a set of photographs illustrating (from bottom to top)

  1. The package design
  2. The top metal layer
  3. A signal layer
  4. A low constant dielectric layer with laser drilled vias
  5. A cross-section of the package showing the low constant thick film on LTCC on alumina ceramic with gold metal layers.

Thermal efficiency was added to the design using molded aluminum nitride as the base ceramic. The ceramic was designed in the shape of an air cooled heatsink. This consultant holds the patent as inventor.

The formulation for the LTCC was developed with Cornell University. During the investigation the process of firing or sintering of the material was characterized.

The result of this effort was a ceramic materials system that meets all of the requirements for high frequency single and multi chip packaging.

Read other articles by this KKAI Associate:

Electrical and Materials Characterization of Microsphere Powder

Complex Module For High Frequency Applications

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Kevin Kennedy & Associates, Inc.
Rapid Response Engineering® Solutions
3905 Vincennes Road, Suite 320
Indianapolis, Indiana 46268
(317) 536-7000 voice
(317) 536-7220 fax

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