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Designing a Phase Change Material Heat Exchanger for Electronic Enclosures
Vice President of Engineering
RAC is a Mechanical Engineer, Heat Transfer Fluid Mechanics Consultant with world-class expertise in heat transfer, fluid mechanics, mass transfer analyses, basic structural analysis, specialization in computer systems and analysis/design of thermal systems, turbulence, natural convection, forced convection, radiation heat transfer, porous media, metal combustion, electrochemistry, chemical thermodynamics, induction heating, material phase change, and the thermal aspects of safety analyses.
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Phase Change Materials (PCMs) have been considered for a number of heat transfer applications. Recently, research in the use of PCMs for electronic systems has increased due to the passive nature of these techniques. The use of passive cooling techniques has the advantage of low maintenance and high reliability. There are no moving parts or components to replace in many of the proposed systems.
Electronic enclosures are exposed to solar loads and thermal loads from the electronics they contain. In some instances, existing passive technologies are not able to remove the thermal load these enclosures experience in the afternoons. One possible solution is the use of a PCM heat exchanger as shown in figure 1.
The system was designed and analyzed through the use of spreadsheet calculations and detailed finite element analyses (FIDAP™). Results of the analyses are shown in figure 2 in terms of heat exchanger temperatures as a function of time for the heat exchanger. Note that the phase change material effectively acts like a constant temperature heat sink for the electronics within the enclosure.
Related References:
Using Finned PCM Heat Exchangers on Electronic Enclosures.
Thermal Management of Outdoor Enclosures Using Phase Change Materials.
Thermal Management of Electronics Enclosures Under Unsteady Heating/Cooling Conditions using Phase Change Materials (PCM).
Read other articles by this KKAI Associate:
Parametric Study of a Thermosyphon
Modeling of Induction Heating with A Computational Fluid Dynamics Package
Modeling of Injection Casting Process
The Design of A Freezing Point Measurement System
| Mechanical Engineer, Heat Transfer Fluid Mechanics Consultant, heat transfer, fluid mechanics, mass transfer analyses, basic structural analysis, specialization in computer systems and analysis/design of thermal systems, turbulence, natural convection, forced convection, radiation heat transfer, porous media, metal combustion, electrochemistry, chemical thermodynamics, induction heating, material phase change, and the thermal aspects of safety analyses. | |
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