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Evaluation of the Thermal Performance of a Potential New Product Line for Electronic Cooling Devices
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KPP is a Mechanical Engineer, Thermal and Fluid Systems Engineer, Engineering Consultant with world-class expertise in thermal systems engineering design, component sizing, integration and analysis, analysis of heat transfer, fluid flow/piping systems
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A client, in the business of providing electronic cooling products, was evaluating a new heat sink product line with dramatically improved cooling performance. The client needed a rapid response thermal analysis of the new design to determine overall thermal conductance values. The client also wanted the thermal analysis models and computer routine for his future in-house use that could be easily modified to evaluate future design changes.
Five design configurations were to be analyzed. The designs consisted of aluminum plates configured for attaching high power electronics on one side and a complex design for forced convection cooling via a motor driven fan on the other side. The five plates were square or rectangular with sizes in the 5 to 10 inch range.
Detailed thermal mathematical models were constructed for the plate designs and thermal analyses predictions were performed using the MITARI thermal analysis computer program. The thermal models included three-dimensional conduction from the electronics mounts, through the plates to the cooling surfaces, and forced air convection from the cooled side of the plates. Power was applied to selected locations in the analysis to simulate electronics to be cooled. Transient and steady state analyses were conducted for each of the five designs.
The transient analyses provided the time to reach a steady temperature for the attached electronics following initial power-up. The steady state analyses provided the temperature distribution within the cooling devices during steady operation. The overall conductance values were then calculated for the client by determining the average temperature of the electronics contact surface areas, subtracting the temperature of the cooling air from the average contact surface temperature and dividing the resulting difference by the power input. These results were determined for the five configurations.
The analysis was completed in 65 hours of effort over a two week period. The thermal models/computer routines, the thermal analysis results and the overall conductance values were supplied to the client on schedule to meet his design needs.
This KKAI Associate acted as Thermal Engineering Consultant and was the sole participant in this effort.
Read other articles by this KKAI Associate:
Design of the International Space Station Radiators to Tolerate Fluid Freezing
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| Mechanical Engineer, Thermal and Fluid Systems Engineer, Engineering Consultant, thermal systems engineering design, component sizing, integration and analysis, analysis of heat transfer, fluid flow/piping systems | |
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Kevin Kennedy & Associates, Inc.
Rapid Response Engineering® Solutions
3905 Vincennes Road, Suite 320
Indianapolis, Indiana 46268
(317) 536-7000 voice
(317) 536-7220 fax